14
RF Device Data
Freescale Semiconductor
MRF6S21100HR3 MRF6S21100HSR3
PRODUCT DOCUMENTATION
Refer to the following documents to aid your design process.
Application Notes
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AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Engineering Bulletins
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EB212: Using Data Sheet Impedances for RF LDMOS Devices
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
7
Jan. 2007
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Added ?TD-SCDMA? to data sheet description paragraph, p. 1
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Removed Lower Thermal Resistance and Low Gold Plating bullets from Features section as functionality
is standard, p. 1
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Removed Forward Transconductance from On Characteristics table as it no longer provided usable
information, p. 2
?
Updated Part Numbers in Table 5, Component Designations and Values, to RoHS compliant part numbers,
p. 3
?
Adjusted scale for Fig. 5, Two-Tone Power Gain versus Output Power, to better match the device?s
capabilities, p. 5
?
Removed lower voltage tests from Fig. 11, Power Gain versus Output Power, due to fixed tuned fixture
limitations, p. 6
?
Replaced Fig. 12, MTTF versus Junction Temperature with updated graph. Removed Amps2
and listed
operating characteristics and location of MTTF calculator for device, p. 7
?
Added TD-SCDMA test circuit schematic, component designations and values, component layout, typical
characteristic curves, test signal and series impedance, p. 9-12
?
Added Product Documentation and Revision History, p. 14